Capabilities
|
Item
|
Capability
|
|
|---|---|---|
|
1
|
SMT Capacity (Million
mount points/ day)
|
1.2
|
|
2
|
Single and double sided
SMT/PTH
|
Yes
|
|
3
|
Large parts on both
sides, BGA on both sides
|
Yes
|
|
4
|
Smallest Chips size
|
0402 (01005)
|
|
5
|
Min BGA and Micro BGA
pitch and ball counts
|
0.3mm pitch, ball count
greater than 1000
|
|
6
|
Min Leaded parts pitch
|
0.3mm pitch
|
|
7
|
Max Parts size assembly
by machine
|
W55 x L100 x T15 (mm)
|
|
8
|
Min Leaded parts pitch Odd form parts:
|
Yes
|
|
9
|
Board Thickness
|
0.4 ~ 4.0 (mm)
|
|
10
|
Max PCB size
|
L510 x W460 (mm)
|
|
11
|
Wave soldering
|
Yes
|
|
12
|
Inspection
|
|
|
13
|
Panelized PCB
|
|
|
14
|
Rework
|
|
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